Usoro Nkwakọ ngwaahịa BGA

Mkpụrụ ma ọ bụ etiti oyi akwa bụ akụkụ dị oke mkpa nke ngwugwu BGA, nke enwere ike iji maka njikwa impedance yana maka njikọta inductor / resistor / capacitor na mgbakwunye na wiring njikọ.Ya mere, ihe mkpụrụ osisi chọrọ ka ọ nwee nnukwu iko mgbanwe okpomọkụ rS (banyere 175 ~ 230 ℃), nkwụsi ike dị elu na ntinye mmiri dị ala, arụmọrụ eletrik dị mma na ntụkwasị obi dị elu.Ihe nkiri metal, mkpuchi mkpuchi na mgbasa ozi mkpụrụ kwesịrị inwekwa ihe nrapado dị elu n'etiti ha.

1. Usoro nkwakọ ngwaahịa nke ndu bonded PBGA

① Nkwadebe nke mkpụrụ osisi PBGA

Laminate dị gịrịgịrị (12 ~ 18μm gbara ọkpụrụkpụ) foil ọla kọpa n'akụkụ abụọ nke bọọdụ BT resin/glass core, wee gwuo oghere na nhazi nke oghere.A na-eji usoro PCB a na-ahụkarị gbakwunyere 3232 iji mepụta eserese n'akụkụ abụọ nke mkpụrụ, dị ka ibe ntuziaka, eletrọd, na ebe a na-ere ihe maka ịgbanye bọọlụ solder.A na-agbakwunye ihe mkpuchi na-emepụta ihe na-emepụta eserese iji kpughee electrodes na ebe ndị na-ere ahịa.Iji kwalite nrụpụta nrụpụta, mkpụrụ osisi na-enwekarị ọtụtụ ihe PBG.

② Usoro nkwakọ ngwaahịa

Wafer thinning → wafer ọnwụ → mgbawa bonding → plasma nhicha → ndu bonding → plasma nhicha → kpụrụ ngwugwu → mgbakọ nke solder bọọlụ → ​​reflow oven soldering → elu marking → nkewa → ikpeazụ nnyocha → ule hopper nkwakọ

Chip bonding na-eji ọlaọcha jupụtara epoxy nrapado na-ejikọta mgbawa IC na mkpụrụ, mgbe ahụ, a na-eji njikọ waya ọla edo iji ghọta njikọ dị n'etiti mgbawa na mkpụrụ ahụ, na-esote ihe mkpuchi plastik a kpụrụ akpụ ma ọ bụ ihe ntanye mmiri iji chebe mgbawa, ahịrị ndị na-ere ahịa. na pads.A na-eji ngwa mbuli emebere emebere iji tinye bọọlụ solder 62/36/2Sn/Pb/Ag ma ọ bụ 63/37/Sn/Pb nwere ebe mgbaze nke 183°C na dayameta nke 30 mil (0.75mm) pads, na reflow soldering ka a na-arụ n'ime oven reflow, na oke nhazi okpomọkụ adịghị ihe karịrị 230 Celsius.A na-eji CFC inorganic Cleaner sachaa mkpụrụ ahụ centrifugaly iji wepụ ihe solder na eriri nke fọdụrụ na ngwugwu ahụ, na-esote akara, nkewa, nyocha ikpeazụ, nnwale, na nkwakọ ngwaahịa maka nchekwa.Ihe dị n'elu bụ usoro nkwakọ ngwaahịa nke ụdị njikọ PBGA.

2. Usoro nkwakọ ngwaahịa nke FC-CBGA

① Ceramic mkpụrụ

Mkpụrụ nke FC-CBGA bụ mkpụrụ osisi seramiiki multilayer, nke siri ike ịme.N'ihi na mkpụrụ nwere nnukwu wiring njupụta, warara spacing, na ọtụtụ site oghere, nakwa dị ka chọrọ nke coplanarity nke mkpụrụ bụ elu.Usoro ya bụ isi bụ: nke mbụ, a na-agbanye mpempe akwụkwọ seramiiki multilayer na okpomọkụ dị elu iji mepụta mkpụrụ osisi seramiiki metallized multilayer, mgbe ahụ, a na-eme wiring metal multilayer na mkpụrụ, wee mee plating, wdg na mgbakọ nke CBGA. , CTE mismatch n'etiti mkpụrụ na mgbawa na PCB osisi bụ isi ihe na-akpata ọdịda nke CBGA ngwaahịa.Iji meziwanye ọnọdụ a, na mgbakwunye na nhazi CCGA, a pụrụ iji ihe ọzọ seramiiki, HITCE seramiiki substrate.

② Usoro nkwakọ ngwaahịa

Nkwadebe nke diski bumps -> ịkpụ diski -> mgbawa flip-flop na reflow soldering -> ndochi ala nke griiz thermal, nkesa nke mkpuchi mkpuchi -> capping -> mgbakọ nke bọọlụ solder -> reflow soldering -> akara -> nkewa -> nyocha ikpeazụ -> nnwale -> nkwakọ ngwaahịa

3. Usoro nkwakọ ngwaahịa nke ndu bonding TBGA

① teepu ihe na-ebu TBGA

A na-ejikarị ihe polyimide eme ihe teepu TBGA.

Na mmepụta, akụkụ abụọ nke teepu ụgbọelu na-ebu ụzọ kpuchie ọla kọpa, emesịa nickel na ọla edo, na-esote ya site na ịkụ ọkpọ site na oghere na n'oghere metallization na mmepụta nke eserese.N'ihi na n'ime ụzọ a jikọtara TBGA, mmiri ọkụ na-ekpo ọkụ na-ekpo ọkụ bụkwa ihe mkpuchi gbakwunyere nke siri ike na isi oghere nke shei tube ahụ, ya mere a na-ejikọta teepu na-ebu ya na ebe a na-ekpo ọkụ ọkụ site na iji nrapado mmetụta nrụgide tupu encapsulation.

② Encapsulation usoro eruba

Chip thinning → Chip cuting → Chip bonding → Cleaning → Lead bonding → Plasma Cleaning → Liquid sealant potting → Mgbakọ bọọlụ → ​​reflow soldering → akara elu → nkewa → nyocha ikpeazụ → Nlebanya → nkwakọ ngwaahịa

Zhejiang NeoDen Technology Co., LTD., tọrọ ntọala na 2010, bụ ọkachamara emeputa pụrụ iche na SMT pick na ebe igwe, reflow oven, stencil obibi igwe, SMT mmepụta akara na ndị ọzọ SMT Ngwaahịa.

Anyị kwenyere na ndị ukwu na ndị mmekọ na-eme NeoDen ka ọ bụrụ nnukwu ụlọ ọrụ yana ntinye aka anyị na Innovation, Diversity and Sustainability na-eme ka a mata na SMT automation na-enweta onye ọ bụla nwere mmasị na ebe niile.

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