1. 0.5mm pitch QFP pad ogologo dị ogologo, na-akpata obere sekit.
2. Mpempe oghere PLCC dị mkpụmkpụ, na-ebute ire ere ụgha.
3. IC si mpe mpe akwa ogologo ogologo na ego nke solder mado bụ nnukwu n'ihi na mkpụmkpụ sekit na reflow.
4. Mpempe mgbawa nke nwere nku dị ogologo iji metụta ndochi ikiri ụkwụ na ikiri ụkwụ na-adịghị mma.
5. The mpe mpe akwa ogologo nke mgbawa components dị oke mkpụmkpụ, dapụtara na shifting, na-emeghe sekit, enweghị ike soldered na ndị ọzọ soldering nsogbu.
6. The ogologo nke mpe mpe akwa nke mgbawa-ụdị components dị ogologo, na-akpata guzo ncheta, oghe sekit, solder nkwonkwo obere tin na ndị ọzọ soldering nsogbu.
7. Pad obosara bụ obosara nke na-akpata nchụpụ akụrụngwa, ihe na-ere ihe efu na tin ezughị ezu na mpe mpe akwa na ntụpọ ndị ọzọ.
8. Pad obosara dị oke obosara, akụrụngwa ngwugwu size na mpe mpe akwa mismatch.
9. The mpe mpe akwa obosara bụ warara, na-emetụta size nke wụrụ awụ solder tinyere akụrụngwa solder ọgwụgwụ na metal elu wetting gbasaa na PCB mpe mpe akwa Nchikota, na-emetụta udi nke solder nkwonkwo, mbenata ntụkwasị obi nke solder nkwonkwo.
10. Pad ozugbo jikọọ na nnukwu ebe ọla kọpa foil, na-akpata ihe ncheta guzoro, solder ụgha na ntụpọ ndị ọzọ.
11. Pad pitch bụ oke ibu ma ọ bụ obere, akụrụngwa solder ọgwụgwụ enweghị ike overlap na mpe mpe akwa overlap, ga-emepụta ihe ncheta, nchụpụ, ụgha solder na ndị ọzọ ntụpọ.
12. Ngwunye pad buru ibu nke na-akpata enweghị ike ịmepụta nkwonkwo solder.
Oge nzipu: Dec-16-2021