1. 0.5mm pitch QFP pad ogologo dị ogologo, na-eme ka obere sekit.
2. Mpempe oghere PLCC dị mkpụmkpụ, na-ebute ire ere ụgha.
3. Pad ogologo nke IC bụ oke ogologo na ego nke solder mado bụ nnukwu na-eme ka mkpirisi sekit na reflow.
4. Mpempe mgbawa nku dị ogologo na-emetụta ndochi ikiri ụkwụ na mmiri ikiri ụkwụ na-adịghị mma.
5. Ogologo ihe mgbochi mgbawa dị mkpụmkpụ nke ukwuu, na-ebute nsogbu ndị na-ere ahịa dị ka ngbanwe, sekit mepere emepe, na enweghị ike ịre ahịa.
6. ogologo ogologo nke mgbawa akụrụngwa na-akpata nsogbu ndị dị ka ihe ncheta guzoro ọtọ, sekit mepere emepe na obere tin na nkwonkwo solder.
7. Obosara mpe mpe akwa sara mbara nke ukwuu na-ebute ntụpọ dị ka mwepu akụrụngwa, ihe na-ere ihe efu na tin ezughi oke na mpe mpe akwa.
8. Obosara mpe mpe akwa obosara nke ukwuu yana ngwungwu akụrụngwa adabaghị na mpe mpe akwa.
9. Solder mpe mpe akwa obosara bụ warara, na-emetụta size nke wụrụ awụ solder tinyere akụrụngwa solder ọgwụgwụ na PCB mpe mpe akwa na Nchikota metal elu wetting mgbasa nwere ike iru, na-emetụta udi nke solder nkwonkwo, mbenata ntụkwasị obi nke solder nkwonkwo. .
10.A na-ejikọta paịlị na-ere ihe ozugbo na nnukwu ebe mkpuchi ọla kọpa, na-ebute ntụpọ dị ka ihe ncheta guzoro ọtọ na ire ere ụgha.
11. Solder mpe mpe akwa pitch bụ oke ibu ma ọ bụ obere, akụrụngwa solder ọgwụgwụ enweghị ike overlap na mpe mpe akwa overlap, nke ga-emepụta ntụpọ dị ka guzo ihe ncheta, mbugharị, na ụgha soldering.
12. Ebe nchekwa ihe na-ere ihe dị oke ukwuu na-akpata enweghị ike ịmepụta nkwonkwo solder.
Oge nzipu: Jan-14-2022