Ihe arụrụ arụrụ ọkụ nke bọọdụ sekit na ihe mwepu imewe ihe nrụpụta ihe achọrọ

1. Ụdị ikpo ọkụ ọkụ, oke na mpaghara nke imewe

Dị ka thermal imewe chọrọ nke chọrọ okpomọkụ dissipation components kwesịrị n'ụzọ zuru ezu tụlee, ga-hụ na junction okpomọkụ nke okpomọkụ-amụba components, PCB elu okpomọkụ izute ngwaahịa imewe chọrọ.

2. Heat sink arịọnụ elu roughness imewe

N'ihi na thermal akara chọrọ nke nnukwu okpomọkụ na-emepụta ihe, okpomọkụ sink na akụkụ nke arịọnụ elu roughness kwesịrị ijide n'aka na iru 3.2µm ma ọ bụ ọbụna 1.6µm, amụbawo kọntaktị ebe nke metal elu, na-eji zuru oke nke thermal conductivity. nke njirimara ihe igwe, iji belata nguzogide okpomọkụ kọntaktị.Ma n'ozuzu, ihe siri ike ekwesịghị ịchọ oke elu.

3. Nhọrọ ihe na-ejuputa

Iji belata nguzogide thermal nke kọntaktị elu nke elu-ike akụrụngwa na-arị elu elu na okpomọkụ sink, interface mkpuchi na thermal conductivity ihe, thermal conductivity filler ihe na elu thermal conductivity kwesịrị họrọ, dị ka ihe atụ, mkpuchi na thermal conductivity. ihe ndị dị ka beryllium oxide (ma ọ bụ aluminum trioxide) seramiiki mpempe akwụkwọ, polyimide film, mica mpempe akwụkwọ, filler ihe dị ka thermally conductive silicone griiz, otu akụkụ vulcanized silicone roba, abụọ-component thermally conductive silicone roba, thermally conductive silicone roba pad.

4. Nwụnye kọntaktị elu

Nwụnye na-enweghị mkpuchi: akụrụngwa na-arị elu elu → okpomọkụ sink na-arị elu → PCB, elu kọntaktị okpukpu abụọ.
Echichi mkpuchi: akụrụngwa na-arị elu elu → okpomọkụ sink na-arị elu elu → mkpuchi mkpuchi → PCB (ma ọ bụ shei chassis), okpukpu atọ nke kọntaktị elu.Mkpuchi oyi akwa arụnyere na nke larịị, kwesịrị dabere na akụrụngwa arịọnụ elu ma ọ bụ PCB elu eletriki mkpuchi chọrọ.