Nrụkọ nkwakọ gụnyere nrụrụ ndu, nkwụghachi ntọala, warpage, mgbawa mgbawa, delamination, voids, nkwakọ na-enweghị isi, burrs, ahụ mba ofesi na ọgwụgwọ ezughị ezu, wdg.
1. Nrụrụ ụzọ
Nrụgharị ndu na-ezokarị aka na nchụpụ ndu ma ọ bụ nrụrụ nke na-eme n'oge mmiri nke plastic sealant, nke a na-egosipụtakarị site na nha x/L n'etiti mgbapụ ụzọ kachasị elu x na ogologo ndu L. Ntugharị ndu nwere ike iduga mkpirisi eletriki (karịsịa. na ngwugwu ngwaọrụ I/O dị elu).Mgbe ụfọdụ nrụgide na-ebute site n'ihulata nwere ike iduga na mgbawa nke njikọ njikọ ma ọ bụ ibelata ike nkekọ.
Ihe na-emetụta njikọ ndu gụnyere nhazi ngwugwu, nhazi ndu, ihe ndu na nha, ịkpụzi ihe eji eme plastik, usoro njikọ ndu, na usoro nkwakọ ngwaahịa.Usoro ndu nke na-emetụta ịgbagọ ndu gụnyere dayameta ndu, ogologo ndu, ibu nkwụsịtụ ndu na njupụta ndu, wdg.
2. Nkwụghachi azụ
Nkwụsị ntọala na-ezo aka na nrụrụ na nkwụsị nke onye na-ebu ya (isi mgbawa) na-akwado mgbawa.
Ihe ndị na-emetụta ngbanwe ntọala gụnyere mgbaba nke ogige ịkpụzi, nhazi mgbakọ ndu, na ihe onwunwe nke ogige ịkpụzi na ledframe.Ngwunye dị ka TSOP na TQFP nwere ike ịdaba na ngbanwe ntọala na nrụrụ pin n'ihi obere ndu ndu ha.
3. Akwụkwọ akụkọ
Warpage bụ ịgbagọ na nrụrụ ngwaọrụ ngwungwu na-apụ apụ.Warpage mere site na ịkpụzi usoro nwere ike iduga a ọnụ ọgụgụ nke ntụkwasị obi okwu dị ka delamination na mgbawa cracking.
Warpage nwekwara ike iduga a nso nke n'ichepụta nsogbu, dị ka na plasticized bọl grid array (PBGA) ngwaọrụ, ebe warpage nwere ike iduga ogbenye solder bọl coplanarity, na-eme ka ọnyịnye nsogbu n'oge reflow nke ngwaọrụ maka mgbakọ na-ebi akwụkwọ sekit osisi.
Ụkpụrụ nke akwụkwọ agha na-agụnye ụdị atọ dị iche iche: concave n'ime, convex apụta na ngwakọta.Na ụlọ ọrụ semiconductor, a na-akpọ concave mgbe ụfọdụ dị ka "ihu ọchị" na convex dị ka "ihu mkpu".Isi ihe na-ebute ibe akwụkwọ agha gụnyere CTE adabaghị na ọgwụgwọ / mkpakọ mbelata.Nke ikpeazụ enwetaghị nlebara anya nke ukwuu na mbụ, mana nyocha miri emi gosipụtara na mbelata kemịkalụ nke ogige ịkpụzi ahụ na-arụkwa ọrụ dị mkpa na IC ngwaọrụ warpage, ọkachasị na ngwugwu nwere ọkpụrụkpụ dị iche iche n'elu na ala mgbawa.
N'oge a na-agwọ ọrịa na post-agwọ ọrịa, ogige ịkpụzi ga-enweta kemịkalụ shrinkage na nnukwu ọgwụgwọ okpomọkụ, nke a na-akpọ "thermochemical shrinkage".Enwere ike ibelata kemịkalụ kemịkalụ na-eme n'oge ọgwụgwọ site n'ịbawanye ogo mgbanwe iko na ibelata mgbanwe ọnụọgụ nke mgbasawanye ọkụ gburugburu Tg.
A pụkwara ịkpata ibe akwụkwọ ozi site na ihe ndị dị ka nhazi nke ogige ịkpụzi, mmiri dị n'ime ihe a na-akpụzi, na geometry nke ngwugwu ahụ.Site n'ịchịkwa ihe na-akpụzi ihe na ihe mejupụtara, usoro usoro, nhazi ngwugwu na gburugburu ebe a na-ekpuchi ya, enwere ike ibelata warpage ngwugwu.N'ọnọdụ ụfọdụ, enwere ike ịkwụ ụgwọ akwụkwọ agha site na ịtinye akụkụ azụ nke mgbakọ eletrọnịkị.Dịka ọmụmaatụ, ọ bụrụ na njikọ mpụga nke nnukwu osisi seramiiki ma ọ bụ osisi multilayer dị n'otu akụkụ, ikpuchi ha n'akụkụ azụ nwere ike ibelata warpage.
4. mgbawa mgbawa
Nchegbu a na-ebute na usoro nkwakọ ngwaahịa nwere ike ibute mgbaji mgbawa.Usoro nkwakọ ngwaahịa na-emekarị ka micro-cracks etolite na usoro mgbakọ gara aga.Wafer ma ọ bụ mgbawa thinning, azụ azụ na-egweri, na mgbawa bonding bụ niile nzọụkwụ na-eduga na ome nke cracks.
Ihe mgbawa gbawara agbawa, nke dara n'ụzọ arụrụ arụ anaghị ebutekarị ọdịda eletrik.Ma mgbawa mgbawa ọ ga-ebute ọdịda eletrik ngwa ngwa nke ngwaọrụ ahụ na-adaberekwa n'ụzọ uto mgbape.Dịka ọmụmaatụ, ọ bụrụ na mgbawa ahụ pụtara n'azụ akụkụ mgbawa, ọ nwere ike ọ gaghị emetụta ihe ọ bụla nwere mmetụta.
N'ihi na wafer silicon dị gịrịgịrị ma na-akụkpọ akụ, nkwakọ ngwaahịa ọkwa wafer na-enwekarị ike ịgbawa mgbawa.Ya mere, usoro usoro dị ka clamping mgbali na ịkpụzi mgbanwe nrụgide na mbufe ịkpụzi usoro ga-siri ike chịkwaa iji gbochie mgbawa mgbawa.Ngwungwu 3D kpokọtara na-adịkarị mfe mgbawa mgbawa n'ihi usoro nchịkọta.Ihe eji emepụta ihe na-emetụta mgbawa mgbawa na ngwugwu 3D gụnyere nhazi ngwugwu mgbawa, ọkpụrụkpụ mkpụrụ, olu ịkpụzi na ọkpụrụkpụ aka uwe, wdg.
Oge nzipu: Feb-15-2023