1. BGA(balụ grid array)
Ngosipụta kọntaktị bọọlụ, otu ngwungwu ụdị elu elu.A na-eme blọọgụ bọọlụ n'azụ mkpụrụ osisi ebipụtara iji dochie ntụtụ ahụ dịka usoro ngosi si dị, a na-agbakọtakwa mgbawa LSI n'ihu mkpụrụ osisi ebipụtara wee jiri resin akpụziri ma ọ bụ usoro ite ite kpuchie ya.A na-akpọkwa nke a bump display carrier (PAC).Ntụtụ nwere ike gafere 200 ma bụrụ ụdị ngwugwu ejiri maka ọtụtụ pin LSI.Enwere ike ịme ka ahụ ngwugwu pere mpe karịa QFP (ngwungwu flat side quad).Dịka ọmụmaatụ, BGA 360-pin nwere ebe pin 1.5mm bụ naanị 31mm square, ebe QFP 304-pin nwere ebe pin 0.5mm bụ 40mm square.Na BGA ekwesịghị ichegbu onwe ya maka nrụrụ pin ka QFP.Ndị Motorola dị na United States mepụtara ngwugwu a ma bụrụ nke mbụ ejiri ya na ngwaọrụ ndị dị ka ekwentị mkpanaaka, ma eleghị anya ọ ga-ewu ewu na United States maka kọmputa nkeonwe n'ọdịnihu.Na mbido, pin (bump) etiti etiti BGA bụ 1.5mm na ọnụọgụ nke pin bụ 225. 500-pin BGA na-emepụtakwa ụfọdụ ndị na-emepụta LSI.nsogbu nke BGA bụ nleba anya n'ile anya mgbe ọ gachara.
2. BQFP (ngwungwu quad flat na bompa)
Otu ngwungwu quad flat nwere bompa, otu n'ime ngwugwu QFP, nwere bumps (bumper) n'akụkụ anọ nke ngwugwu ahụ iji gbochie ịgbagọ ntụtụ n'oge mbupu.Ndị na-emepụta semiconductor US na-eji ngwugwu a tumadi na sekit dị ka microprocessors na ASIC.Pin n'etiti anya 0.635mm, ọnụọgụ nke pin si 84 ruo 196 ma ọ bụ karịa.
3. Bump solder PGA(butt joint pin grid array) Utu aha elu ugwu PGA.
4. C (seramiiki)
Akara nke ngwugwu seramiiki.Dịka ọmụmaatụ, CDIP pụtara ceramic DIP, nke a na-ejikarị eme ihe.
5. Cerdip
Ihe ngwungwu in-line nke seramiiki ejiri iko mechie, ejiri maka ECL RAM, DSP (Digital Signal Processor) na sekit ndị ọzọ.A na-eji Cerdip nwere windo iko maka ụdị EPROM ehichapụ UV na sekit microcomputer nwere EPROM n'ime.Ebe dị anya n'etiti pin bụ 2.54mm yana ọnụọgụ nke pin si 8 ruo 42.
6. Cerquad
Otu n'ime ngwungwu elu elu, seramiiki QFP nwere akara n'okpuru, na-eji ekpokọta sekit LSI mgbagha dị ka DSP.A na-eji Cerquad nwere windo chịkọta sekit EPROM.Mgbasa ọkụ dị mma karịa plastik QFPs, na-enye ohere 1.5 ruo 2W nke ike n'okpuru ọnọdụ oyi ikuku.Otú ọ dị, ọnụ ahịa ngwugwu bụ 3 ruo 5 ugboro karịa plastik QFPs.Pin center anya bụ 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, wdg The ọnụ ọgụgụ nke atụdo ranges si 32 ka 368.
7. CLCC (onye na-ebu ihe mgbawa seramiiki)
Onye na-ebu ihe mgbawa seramiiki nwere atụdo, otu n'ime ngwungwu elu elu, a na-eduga ntụtụ ahụ site n'akụkụ anọ nke ngwugwu ahụ, n'ụdị ding.Na a window maka ngwugwu nke UV erasure ụdị EPROM na microcomputer circuit na EPROM, wdg .. Nke a ngwugwu na-akpọ QFJ, QFJ-G.
8. COB (mgbawa n'elu osisi)
Ngwungwu mgbawa bụ otu n'ime teknụzụ na-arị elu nke mgbawa, a na-etinye mgbawa semiconductor na bọọdụ sekit ebipụtara, njikọ eletrik n'etiti mgbawa na mkpụrụ na-enweta site na ụzọ nkedo ụzọ, njikọ eletrik dị n'etiti mgbawa na mkpụrụ na-enweta site na ụzọ nkedo ụzọ. , ma kpuchie ya na resin iji hụ na a pụrụ ịdabere na ya.Ọ bụ ezie na COB bụ teknụzụ na-ebuli mgbawa kachasị mfe, mana njupụta ngwugwu ya dị ala karịa TAB na teknụzụ ịgbanye mgbawa.
9. DFP(ngwugwu okpukpu abụọ)
Ngwungwu larịị n'akụkụ abụọ.Ọ bụ utu aha nke SOP.
10. DIC (ngwungwu seramiiki nwere eriri abụọ)
Ceramic DIP (ya na akara iko) utu aha.
11. DIL (abụọ in-line)
DIP utu aha (lee DIP).Ndị na-emepụta semiconductor Europe na-ejikarị aha a.
12. DIP(ngwungwu abuo in-line)
Ngwungwu in-line okpukpu abụọ.Otu n'ime ngwugwu katrij, a na-eduzi atụdo site n'akụkụ abụọ nke ngwugwu ahụ, ihe ngwugwu nwere ụdị plastik abụọ na seramiiki.DIP bụ ngwugwu katrij nke kachasị ewu ewu, ngwa gụnyere ọkọlọtọ IC ọkọlọtọ, ebe nchekwa LSI, microcomputer circuits, wdg. Ogologo etiti pin bụ 2.54mm na ọnụ ọgụgụ nke pin sitere na 6 ruo 64. ngwugwu ngwugwu na-abụkarị 15.2mm.ụfọdụ ngwugwu nwere obosara nke 7.52mm na 10.16mm ka a na-akpọ DIP skinny na slim DIP n'otu n'otu.Na mgbakwunye, seramiiki DIP nke ejiri iko mgbaze dị ala mechie ka a na-akpọkwa cerdip (lee cerdip).
13. DSO (dual obere out-lint)
Utu aha maka SOP (lee SOP).Ụfọdụ ndị na-emepụta semiconductor na-eji aha a.
14. DICP(ngwungwu ihe na-ebu teepu abụọ)
Otu n'ime TCP (ngwungwu ihe na-ebu teepu).A na-eme ntụtụ ahụ na teepu mkpuchi ma na-esi n'akụkụ abụọ nke ngwugwu pụta.N'ihi iji teknụzụ TAB (akpaaka teepu ụgbọelu soldering), profaịlụ ngwugwu dị ezigbo mkpa.A na-ejikarị ya eme ihe maka LSI ọkwọ ụgbọ ala LCD, mana ọtụtụ n'ime ha bụ omenala.Na mgbakwunye, ngwungwu akwụkwọ nta LSI nke ebe nchekwa 0.5mm na-emepe emepe.Na Japan, a na-akpọ DICP DTP dịka ọkọlọtọ EIAJ (Electronic Industries and Machinery of Japan).
15. DIP(ngwungwu ihe na-ebu teepu abụọ)
Otu dị ka n'elu.Aha DTCP na ọkọlọtọ EIAJ.
16. FP (ngwugwu larịị)
Ngwungwu dị larịị.Utu aha maka QFP ma ọ bụ SOP (lee QFP na SOP).Ụfọdụ ndị na-emepụta semiconductor na-eji aha a.
17. tụgharịa-chip
tụgharịa-chip.Otu n'ime teknụzụ nkwakọ ihe na-enweghị mgbawa nke a na-eme mgbapu ígwè na mpaghara electrode nke mgbawa LSI wee na-eresị ihe mgbawa ahụ na mpaghara electrode na mkpụrụ ebi ebi.Mpaghara nke ngwugwu ahụ nwere bụ isi na nha mgbawa ahụ.Ọ bụ nke kacha nta na nke kacha dị mkpa na teknụzụ nkwakọ ngwaahịa niile.Otú ọ dị, ọ bụrụ na ọnụọgụ nke mgbasawanye okpomọkụ nke mkpụrụ ahụ dị iche na nke mgbawa LSI, ọ nwere ike meghachi omume na nkwonkwo ma si otú a na-emetụta ntụkwasị obi nke njikọ ahụ.Ya mere, ọ dị mkpa iji resin mee ka mgbawa LSI sie ike ma jiri ihe na-emepụta ihe nwere ihe dịka otu ọnụọgụ nke mgbasawanye ọkụ.
18. FQFP(ngwugwu quad flat dị mma)
QFP nwere obere anya etiti pin, na-adịkarị ala karịa 0.65mm (lee QFP).Ụfọdụ ndị na-emepụta ihe na-eji aha a.
19. CPAC(globe top pad array carrier)
Motorola's utu aha maka BGA.
20. CQFP(quad fiat ngwugwu na mgbanaka nche)
Quad fiat ngwugwu nwere mgbanaka nche.Otu n'ime QFPs plastik, a na-eji mgbanaka resin nchebe kpuchie ntụtụ ndị ahụ iji gbochie ịgbagọ na nrụrụ.Tupu ikpokọta LSI na mkpụrụ e biri ebi, a na-ebipụ ihe atụ ndị ahụ site na mgbanaka nche ma mee ka ọ bụrụ nku mmiri mmiri (L-ụdị).A na-emepụta ngwugwu a na Motorola, USA.Ebe dị anya n'etiti pin bụ 0.5mm, yana ọnụ ọgụgụ kachasị nke ntụtụ bụ ihe dịka 208.
21. H- (ya na ikpo ọkụ)
Na-egosi akara nwere ebe ikpo ọkụ.Dịka ọmụmaatụ, HSOP na-egosi SOP na ikpo ọkụ.
22. pin grid n'usoro (ụdị ugwu elu)
The elu ugwu ụdị PGA na-abụkarị a katrij ụdị ngwugwu na a ntụtụ ogologo banyere 3.4mm, na elu ugwu ụdị PGA nwere a ngosi nke atụdo na ala n'akụkụ nke ngwugwu na a ogologo si 1.5mm ka 2.0mm.Ebe ọ bụ na pin center anya bụ naanị 1.27mm, nke bụ ọkara size nke katrij ụdị PGA, ngwugwu ozu nwere ike ime ka nta, na ọnụ ọgụgụ nke atụdo bụ karịa nke katrij ụdị (250-528), ya mere, ọ. bụ ngwugwu ejiri maka nnukwu mgbagha LSI.Ngwakọta ngwugwu bụ mkpụrụ seramiiki multilayer na ihe eji ebi akwụkwọ epoxy resin iko.Mmepụta nke ngwugwu na ọtụtụ seramiiki substrates aghọwo ihe bara uru.
23. JLCC ( J-edu mgbawa ebu)
Obu mgbawa n'ụdị J.Na-ezo aka na CLCC nke windo na utu aha ceramic QFJ nwere windo (lee CLCC na QFJ).Ụfọdụ ndị na-emepụta ihe na-emepụta ihe na-eji aha ahụ.
24. LCC (onye na-ebu mgbawa na-enweghị ndu)
Onye na-ebu mgbawa na-enweghị pin.Ọ na-ezo aka n'elu ngwugwu ngwugwu nke naanị electrodes n'akụkụ anọ nke seramiiki mkpụrụ na kọntaktị na-enweghị atụdo.Ngwungwu IC dị elu na nke dị elu, nke a makwaara dị ka ceramic QFN ma ọ bụ QFN-C.
25. LGA (ala grid array)
Ngwungwu ngosi kọntaktị.Ọ bụ ngwugwu nwere ọtụtụ kọntaktị n'akụkụ ala.Mgbe a na-agbakọta, enwere ike itinye ya na oghere.Enwere kọntaktị 227 (1.27mm center distance) na kọntaktị 447 (2.54mm center distance) nke seramiiki LGAs, nke a na-eji na mgbanaka LSI dị elu.LGA nwere ike nabata ntụtụ ntinye na mmepụta n'ime obere ngwugwu karịa QFP.Tụkwasị na nke ahụ, n'ihi nkwụsị dị ala nke ndị na-eduga, ọ dị mma maka LSI dị elu.Otú ọ dị, n'ihi mgbagwoju anya na ọnụ ahịa dị elu nke ime oghere, a naghị eji ha eme ihe ugbu a.A na-atụ anya ka a na-achọ ha ga-abawanye n'ọdịnihu.
26. LOC(edu na mgbawa)
Nkà na ụzụ nkwakọ ngwaahịa LSI bụ usoro nke n'ihu njedebe nke ụzọ ụzọ dị n'elu mgbawa ma na-eme njikọ na-ekpo ọkụ na-ekpo ọkụ n'akụkụ etiti mgbawa ahụ, a na-eme njikọ eletrik site na ijikọta ụzọ ọnụ.N'iji ya tụnyere nhazi mbụ ebe a na-etinye eriri ndu n'akụkụ akụkụ mgbawa ahụ, enwere ike ịnabata mgbawa ahụ n'otu ngwugwu ahụ nwere obosara nke ihe dịka 1mm.
27. LQFP (obere profaịlụ quad flat)
QFP dị gịrịgịrị na-ezo aka na QFPs nwere ọkpụrụkpụ ahụ dị ngwungwu 1.4mm, ọ bụkwa aha Japan Electronics Machinery Industry Association ji dị ka nkọwapụta ụdị QFP ọhụrụ si dị.
28. L-QUAD
Otu n'ime seramiiki QFP.A na-eji aluminom nitride mee ihe maka ngwugwu ngwugwu, na conductivity thermal conductivity nke isi bụ 7 ruo 8 ugboro dị elu karịa nke aluminom oxide, na-enye nkwụsị ọkụ ka mma.A na-eji aluminom oxide mee etiti ngwugwu ahụ, a na-emechikwa mgbawa ahụ site na usoro ite, si otú a na-ebelata ọnụ ahịa ya.Ọ bụ ngwugwu emepụtara maka ezi uche LSI ma nwee ike ịnabata ike W3 n'okpuru ọnọdụ ikuku jụrụ oyi.Ihe ngwugwu 208-pin (0.5mm center pitch) na 160-pin (0.65mm center pitch) maka mgbagha LSI ka emepụtara ma tinye ya na mmepụta oke na Ọktoba 1993.
29. MCM(multi-chip modul)
Multi-chip modul.Otu ngwungwu nke a na-agbakọta ọtụtụ obere semiconductor iferi n'elu eriri waya.Dị ka ihe mkpụrụ osisi si dị, enwere ike kewaa ya ụzọ atọ, MCM-L, MCM-C na MCM-D.MCM-L bụ mgbakọ na-eji iko epoxy resin multilayer ebipụta na mbụ.Ọ dị obere obere ma dịkwa ọnụ ala.MCM-C bụ akụrụngwa na-eji teknụzụ ihe nkiri gbara ọkpụrụkpụ iji mepụta wiring multilayer na seramiiki (alumina ma ọ bụ seramiiki iko) dị ka mkpụrụ, dị ka IC ngwakọ ihe nkiri siri ike na-eji substrates seramiiki multilayer.Enweghị nnukwu ọdịiche dị n'etiti abụọ ahụ.Njupụta wiring dị elu karịa nke MCM-L.
MCM-D bụ akụrụngwa na-eji teknụzụ ihe nkiri dị mkpa iji mepụta wiring multilayer na seramiiki (alumina ma ọ bụ aluminom nitride) ma ọ bụ Si na Al dị ka mkpụrụ.Njupụta wiring bụ nke kachasị elu n'etiti ụdị ihe atọ dị na ya, mana ọnụ ahịa ya dịkwa elu.
30. MFP(obere obere ngwugwu)
Obere ngwugwu.Utu aha maka plastic SOP ma ọ bụ SSOP (lee SOP na SSOP).Aha ụfọdụ ndị nrụpụta semiconductor ji.
31. MQFP(metric quad flat pack)
Nhazi nke QFP dị ka ọkọlọtọ JEDEC (Kọmitii Ngwakọta Ngwakọta Eletrọnịkị) siri dị.Ọ na-ezo aka ọkọlọtọ QFP nwere ntụtụ etiti anya nke 0.65mm yana ọkpụrụkpụ ahụ nke 3.8mm ruo 2.0mm (lee QFP).
32. MQUAD (metal quad)
Ngwungwu QFP nke Olin, USA mepụtara.A na-eji aluminom mee efere ntọala na mkpuchi ma jiri nrapado mechie ya.Ọ nwere ike ikwe ka 2.5W ~ 2.8W nke ike n'okpuru ọnọdụ ikuku oyi.Nippon Shinko Kogyo nwere ikike ịmalite mmepụta na 1993.
33. MSP(obere square ngwugwu)
QFI utu aha (lee QFI), n'oge mmalite nke mmepe, nke a na-akpọkarị MSP, QFI bụ aha nke Japan Electronics Machinery Industry Association debere.
34. OPMAC(n'elu kpụrụ mpe mpe akwa array ụgbọelu)
Obu ihe ngosi resin akara akpụ akpụ.Aha Motorola ji mee resin sealing BGA (lee BGA).
35. P- (plastic)
Na-egosi akara ngosi ngwugwu plastik.Dịka ọmụmaatụ, PDIP pụtara DIP plastik.
36. PAC(pad array carrier)
Obu ihe ngosi bump, utu aha nke BGA (lee BGA).
37. PCLP(ngwugwu sekit enweghị ụzọ e biri ebi)
Ihe ngwungwu enweghị ụzọ sekit ebipụtara.Ogologo etiti pin nwere nkọwa abụọ: 0.55mm na 0.4mm.Ugbu a na mmepe ogbo.
38. PFPF (ngwugwu flat plastic)
Ngwungwu ewepụghị plastik.Utu aha maka plastik QFP (lee QFP).Ụfọdụ ndị na-emepụta LSI na-eji aha ahụ.
39. PGA(pin grid array)
Ngwungwu ngwungwu pin.Otu n'ime ngwugwu ụdị katrij nke a na-ahazi atụdo kwụ ọtọ n'akụkụ ala n'ụdị ngosi.N'ụzọ bụ isi, a na-eji ihe ntanetị seramiiki multilayer maka ngwugwu ngwugwu.N'ọnọdụ ebe a na-akọwapụtaghị aha ihe ahụ kpọmkwem, ọtụtụ bụ ceramic PGA, nke a na-eji maka nnukwu ọsọ ọsọ, nnukwu mgbagha mgbagha LSI.Ọnụ ego ahụ dị elu.Pin emmepe bụ a 2.54mm iche na ntụtụ agụ si 64 ka banyere 447. Iji belata na-eri, ngwugwu mkpụrụ nwere ike dochie a iko epoxy ebi mkpụrụ.Plastic PG A nwere ntụtụ 64 ruo 256 dịkwa.Enwekwara ụdị mgbago elu ntụtụ dị mkpụmkpụ PGA (aka-solder PGA) nwere oghere etiti pin nke 1.27mm.(Lee ụdị elu ugwu PGA).
40. Piggy azụ
ngwugwu ngwugwu.Ngwungwu seramiiki nwere oghere, nke dị ka DIP, QFP, ma ọ bụ QFN.Ejiri ya na mmepe nke ngwaọrụ nwere microcomputer iji nyochaa arụmọrụ nkwenye mmemme.Dịka ọmụmaatụ, etinyere EPROM n'ime oghere maka nbipu.Ngwungwu a bụ ngwaahịa ahaziri ahazi, ọ bụghịkwa ebe niile n'ahịa.
Oge nzipu: Mee-27-2022