Nkewa nke substrates
Enwere ike kewaa ihe mbadamba akwụkwọ ebipụtara n'ozuzu ụzọ abụọ: ihe mkpụrụ osisi siri ike na ihe ndị na-agbanwe agbanwe.Ụdị ihe dị mkpa nke ihe eji eme ihe n'ozuzu ya bụ ihe mkpuchi ọla kọpa.A na-eme ya nke Reinforeing Material, nke etinyere ya na ihe nkedo resin, nke a mịrị amị, bee ma tinye ya n'ime oghere, wee kpuchie ya na foil ọla kọpa, na-eji mpempe ígwè dị ka ihe ọkpụkpụ, na-edozi ya site na nnukwu okpomọkụ na nrụgide dị elu n'ime ebe a na-ekpo ọkụ.General multilayer ọkara gwọrọ mpempe akwụkwọ, bụ ọla kọpa kpuchiri na mmepụta usoro nke ọkara emechara ngwaahịa (ọtụtụ n'ime iko ákwà tinye ya na resin, site ihicha nhazi).
Enwere ụzọ nhazi ọkwa dị iche iche maka laminate ọla kọpa.N'ozuzu, dị ka dị iche iche mkwado ihe nke osisi, ọ nwere ike kewara ise: isi akwụkwọ, iko eriri ákwà isi, mejupụtara isi (CEM usoro), laminated multilayer osisi isi na pụrụ iche ihe isi (seramiiki, metal isi isi, wdg).Ọ bụrụ na bọọdụ eji dị iche iche resin adhesives maka nhazi ọkwa, akwụkwọ nkịtị - CCI dabeere.Enwere: resin phenolic (XPc, XxxPC, FR 1, FR 2, wdg), resin epoxy (FE 3), resin polyester na ụdị ndị ọzọ.CCL a na-ahụkarị bụ resin epoxy (FR-4, FR-5), nke bụ ụdị akwa eriri iko a na-ejikarị eme ihe.Tụkwasị na nke ahụ, e nwere resins ndị ọzọ pụrụ iche (akwa akwa iko, eriri polyamide, akwa na-abụghị nke a kpara akpa, wdg, dị ka ihe agbakwunyere) : bismaleimide modified trizine resin (BT), polyimide resin (PI), diphenyl ether resin (PPO), maleic anhydride imide - styrene resin (MS), polycyanate ester resin, polyolefin resin, wdg.
Dị ka ọkụ retardant arụmọrụ nke CCL, ọ nwere ike kewaa n'ime ire retardant ụdị (UL94-VO, UL94-V1) na-abụghị ire retardant ụdị (Ul94-HB).N'ime afọ 12 gara aga, dị ka a na-eleba anya na nchebe gburugburu ebe obibi, e kewapụrụ ụdị ọhụrụ nke ọkụ-retardant CCL na-enweghị bromine, nke a pụrụ ịkpọ "green flame-retardant CCL".Site na mmepe ngwa ngwa nke teknụzụ ngwaahịa eletrọnịkị, cCL nwere oke arụmọrụ chọrọ.Ya mere, site na CCL arụmọrụ nkewa, na kewara n'ime izugbe arụmọrụ CCL, ala dielectric mgbe nile CCL, elu okpomọkụ na-eguzogide CCL (n'ozuzu efere L na 150 ℃ n'elu), ala thermal mgbasa ọnụọgụ CCL (nke a na-ejikarị na nkwakọ ngwaahịa) na ụdị ndị ọzọ. .
Standard nke mmejuputa substrate
Na mmepe na-aga n'ihu na-aga n'ihu na nkà na ụzụ electronic, ọhụrụ chọrọ na-mgbe niile etinye n'ihu maka ebi ebi osisi substrate ihe, nke mere na-akwalite na-aga n'ihu mmepe nke ọla kọpa clad efere ụkpụrụ.Ka ọ dị ugbu a, ụkpụrụ bụ isi maka ihe ndị substrate bụ ndị a.
1) National Standards for Substrates Ka ọ dị ugbu a, ụkpụrụ mba maka substrates na China gụnyere GB/T4721 — 4722 1992 na GB 4723 — 4725 — 1992. Ụkpụrụ maka ọla kọpa clad laminates na mpaghara Taiwan nke China bụ ọkọlọtọ CNS, nke dabere na ọkọlọtọ CNS. na ọkọlọtọ JI Japanese wee nye ya na 1983.
Na mmepe na-aga n'ihu na-aga n'ihu na nkà na ụzụ electronic, ọhụrụ chọrọ na-mgbe niile etinye n'ihu maka ebi ebi osisi substrate ihe, nke mere na-akwalite na-aga n'ihu mmepe nke ọla kọpa clad efere ụkpụrụ.Ka ọ dị ugbu a, ụkpụrụ bụ isi maka ihe ndị substrate bụ ndị a.
1) National Standards for Substrates Ka ọ dị ugbu a, ụkpụrụ mba China maka ihe ntinye gụnyere GB/T4721 — 4722 1992 na GB 4723 — 4725 — 1992. Ụkpụrụ maka ọla kọpa clad laminates na mpaghara Taiwan nke China bụ ọkọlọtọ CNS, nke dabere na ya. Standardkpụrụ JI Japanese wee nye ya na 1983.
2) Ụkpụrụ mba ndị ọzọ gụnyere ọkọlọtọ JIS Japanese, American ASTM, NEMA, MIL, IPC, ANSI na UL ọkọlọtọ, ọkọlọtọ British Bs, German DIN na VDE ọkọlọtọ, French NFC na UTE ọkọlọtọ, Canadian CSA ọkọlọtọ, Australian AS ọkọlọtọ, FOCT ọkọlọtọ. nke bụbu Soviet Union, na ọkọlọtọ IEC mba ụwa
A na-akpọ ọkọlọtọ nchịkọta aha ọkọlọtọ mba dị ka ngalaba nke nhazi aha ọkọlọtọ
JIS- Japan Industrial Standard – Japan Specification Association
ASTM- American Society for Laboratory Materials Standards - American Society fof Testi 'ng and Materials
NEMA- National Association of Electric Manufactures Standard -Nafiomll Electric Manufactures
MH- Ụkpụrụ ndị agha United States-Ngalaba nke nchekwa nchekwa ndị agha akọwapụtara na ụkpụrụ
IPC- American Circuit Interconnection and Packaging Association Standard -Izu ahụ bụ eziokwu maka njikọta na ịkwakọ sekit EIectronics
ANSl- American National Standard Institute
Oge nzipu: Dec-04-2020