Nzọụkwụ 6 nke Basic Usoro nke Multilayer Circuit Board

The mmepụta usoro nke multilayer mbadamba bụ n'ozuzu na-eme site n'ime oyi akwa ndịna-emeputa na mbụ, mgbe ahụ site na-ebi akwụkwọ na etching usoro na-eme ka a otu akụkụ ma ọ bụ abụọ akụkụ mkpụrụ, na n'ime họpụtara oyi akwa n'etiti, na mgbe ahụ site kpo oku, ịpị na bonding. n'ihi na ụdi mkpọpu ihe bụ otu ihe ahụ okpukpu abụọ-kwadoro plating site-oghere ụzọ.

1. Nke mbụ, a ga-ebu ụzọ mepụta bọọdụ sekit FR4.Mgbe ị na-etinye ọla kọpa gbawara agbawa na mkpụrụ, oghere ndị ahụ na-ejupụta na resin na ahịrị elu na-etolite site na etching subtractive.Nzọụkwụ a bụ otu ihe ahụ na bọọdụ FR4 izugbe ma e wezụga maka njupụta nke perforations na resin.

2. A na-etinye resin photopolymer epoxy resin dị ka oyi akwa nke mbụ nke mkpuchi FV1, na mgbe ihicha, a na-eji fotomask mee ihe maka nzọụkwụ ikpughe, na mgbe ekpughere ya, a na-eji ihe mgbaze na-emepụta oghere dị ala nke oghere peg.A na-eme ihe ike nke resin mgbe oghere nke oghere ahụ gasịrị.

3. The epoxy resin elu na-roughened site permanganic acid etching, na mgbe etching, a oyi akwa nke ọla kọpa kpụrụ n'elu site electroless ọla kọpa plating maka ụdi ọla kọpa plating nzọụkwụ.Mgbe plasta, a na-emepụta oyi akwa ọla kọpa ma na-emepụta oyi akwa site na etching subtractive.

4. Ejiri akwa mkpuchi nke abụọ kpuchie ya, na-eji otu usoro mmepe mmepe ahụ na-emepụta oghere bolt n'okpuru oghere.

5. Ọ bụrụ na ọ dị mkpa maka perforation, ị nwere ike iji mkpọpu oghere na-etolite perforations mgbe e guzobere ọla kọpa electroplating etching na-etolite waya.
na n'elu oyi akwa nke sekit osisi mkpuchi na mgbochi-tin agba, na ojiji nke ikpughe usoro mmepe na-ekpughe akụkụ kọntaktị.

6. Ọ bụrụ na ọnụ ọgụgụ nke n'ígwé na-abawanye, ihu ọma dị nnọọ ikwugharị n'elu nzọụkwụ.Ọ bụrụ na e nwere ọkwa ndị ọzọ n'akụkụ abụọ ahụ, a ga-ekpuchi mkpuchi mkpuchi ahụ n'akụkụ abụọ nke oyi akwa isi, ma enwere ike ịme usoro nhazi n'akụkụ abụọ n'otu oge ahụ.

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Oge nzipu: Nov-09-2022

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