I. Nkọwa ndabere
Igwe na-ere ebili mmiriịgbado ọkụ bụ site wụrụ awụ solder na akụrụngwa atụdo maka ngwa nke solder na kpo oku, n'ihi na ikwu ije nke ife na PCB na a wụrụ awụ solder “nyapade”, ife soldering usoro bụ nnọọ mgbagwoju anya karịa reflow soldering, na-soldered ngwugwu. pin spacing, pin si ogologo, mpe mpe akwa chọrọ, na PCB The okirikiri nhọrọ ukwuu nke osisi direction, spacing, nakwa dị ka echichi nke oghere ahịrị nwekwara ihe a chọrọ, na nkenke, ife soldering usoro adịghị mma, achọ, ịgbado ọkụ. mkpụrụ isi dabere na imewe.
II.Achọrọ nkwakọ ngwaahịa
1. adabara ife soldering ọnyịnye mmewere kwesịrị solder ọgwụgwụ ma ọ bụ ndu ọgwụgwụ kpughere;Ngwunye ngwugwu site na nkwụsị ala (Kwụsị Gbanyụọ) <0.15mm;Ogologo <4mm chọrọ isi ihe achọrọ.Zute ọnọdụ ndị a nke akụrụngwa ntinye gụnyere:
0603 ~ 1206 ngwugwu nha nke ihe mgbochi mgbawa.
SOP nwere ebe etiti ndu ≥1.0mm na ịdị elu <4mm.
Chip inductors nwere ịdị elu ≤ 4mm.
Inductor mgbawa igwe anaghị ekpughe (ya bụ, ụdị C, M)
2. dabara adaba maka ire ere mmiri nke akụrụngwa katrijụ ụkwụ ukwu maka ebe kacha nta n'etiti ntụtụ dị nso ≥ 1.75mm ngwugwu.
III.Ntuziaka nnyefe
Tupu ebili mmiri soldering n'elu akụrụngwa okirikiri nhọrọ ukwuu, nke mbụ kwesịrị ikpebi PCB n'elu ọkụ nnyefe direction, ọ bụ okirikiri nhọrọ ukwuu nke katrij components "usoro benchmark".Ya mere, tupu ife soldering elu components okirikiri nhọrọ ukwuu, nke mbụ kwesịrị ikpebi ntụziaka nke nnyefe.
1. N'ozuzu, ogologo akụkụ kwesịrị ịbụ ntụziaka nke nnyefe.
2. Ọ bụrụ na nhazi ahụ nwere njikọ njikọ cartridge dị nso (pitch <2.54mm), nhazi nhazi nke njikọ kwesịrị ịbụ ntụziaka nke nnyefe.
3. na ife soldering elu, kwesịrị ịbụ silk-screened ma ọ bụ ọla kọpa foil etched akụ akara ntụziaka nke nnyefe, iji mata mgbe ịgbado ọkụ.
IV.Ntuziaka nhazi
Ntuziaka nhazi nke akụrụngwa na-agụnye akụkụ mgbawa na njikọ ọtụtụ pin.
1. ogologo ntụziaka nke ngwugwu ngwaọrụ SOP kwesịrị ịdị na ya na nhazi ntụgharị ntụgharị nke ikuku, ogologo ntụzịaka nke ihe mgbawa, kwesịrị ịdị n'ụzọ ziri ezi na ntụgharị nnyefe nke ikuku.
2. multiple abụọ-pin katrij components, jack center akara direction kwesịrị perpendicular na ntụziaka nke nnyefe, iji belata onu nke otu nsọtụ nke akụrụngwa sere n'elu.
V. chọrọ ohere ohere
Maka akụrụngwa SMD, oghere mpe mpe akwa na-ezo aka na etiti oge n'etiti njirimara mgbasa ozi kachasị nke ngwugwu dị n'akụkụ (gụnyere pad);maka akụrụngwa katrij, oghere mpe mpe akwa na-ezo aka n'etiti etiti n'etiti paịlị na-ere ihe.
Maka akụrụngwa SMD, oghere mpe mpe akwa esighị na akụkụ njikọ akwa, gụnyere mmetụta mgbochi nke ngwugwu ahụ nwere ike bute ntapu nke ihe na-ere ahịa.
1. katrij components pad etiti oge kwesịrị n'ozuzu ≥ 1.00mm.maka ezigbo njikọ katrij pitch, kwe ka mbelata kwesịrị ekwesị, mana opekempe ekwesịghị ịbụ <0.60mm.
2. paịlị akụrụngwa katrij na ihe na-efe efe nke SMD akụrụngwa kwesịrị ịbụ ≥ 1.25mm etiti oge.
VI.Pad imewe pụrụ iche chọrọ
1. iji belata ire ere mmiri, maka 0805/0603, SOT, SOP, tantalum capacitor pads, a na-atụ aro ka imewe ahụ dabere na ihe ndị a chọrọ.
Maka akụrụngwa 0805/0603, dabere na atụmatụ IPC-7351 tụrụ aro (pad flare 0.2mm, obosara belatara site na 30%).
Maka SOT na tantalum capacitors, ekwesịrị ịgbasa pad ahụ n'èzí site na 0.3mm ma e jiri ya tụnyere paịlị a na-emepụtakarị.
2. maka metalized oghere efere, ike nke solder nkwonkwo tumadi na-adabere na oghere njikọ, mpe mpe akwa mgbanaka obosara ≥ 0.25mm nwere ike ịbụ.
3. N'ihi na-abụghị metallized oghere efere (otu panel), ike nke solder nkwonkwo na-ekpebi site pad size, n'ozuzu pad dayameta kwesịrị ≥ 2.5 ugboro dayameta nke oghere.
4. n'ihi na SOP ngwugwu, kwesịrị e mere na njedebe nke tinned atụdo na-ezu ohi tin pads, ma ọ bụrụ na SOP pitch bụ dịtụ nnukwu, na-ezu ohi tin pad imewe nwekwara ike ibu ibu.
5. maka multi-pin njikọ, ekwesịrị ka emebere ya na njedebe tin nke mpempe akwụkwọ zuru ezu.
VII.Wepụta ogologo
1. ụzọ pụta ogologo nke guzobe nke àkwà mmiri nwere oké mmekọrịta, nta na pin spacing, ukwuu mmetụta nke izugbe na-atụ aro:
Ọ bụrụ na pin pitch bụ n'etiti 2 ~ 2.54mm, ụzọ ndọtị ogologo kwesịrị ịchịkwa na 0.8 ~ 1.3mm
Ọ bụrụ na pin pitch <2mm, ogologo ndọtị ndu kwesịrị ịchịkwa na 0.5 ~ 1.0mm
2. na-eduga n'ogologo naanị na akụkụ okirikiri nhọrọ ukwuu ntụziaka izute chọrọ nke ife soldering ọnọdụ nwere ike ịrụ ọrụ, ma ọ bụghị na mkpochapụ nke mmetụta nke àkwà mmiri njikọ bụ doro anya.
VIII.ngwa nke solder iguzogide ink
1. anyị na-ahụkarị ụfọdụ njikọ mpe mpe akwa ndịna-emeputa ọnọdụ e biri ebi na ink ndịna-emeputa, ndị dị otú ahụ a imewe na-adịkarị na-atụle ibelata onu nke bridgeing.Usoro nwere ike ịbụ ink oyi akwa elu bụ dịtụ siri ike, dị mfe adsorb ọzọ flux, flux zutere na elu okpomọkụ gbazere solder volatilization na guzobe iche egosipụta, si otú ibelata omume nke achịkọta.
2. Ọ bụrụ na anya n'etiti pin mpe mpe akwa <1.0mm, ị nwere ike chepụta solder eguzogide ink oyi akwa n'èzí mpe mpe akwa iji belata ihe gbasara nke puru omume nke bridging, nke tumadi ewepu ok pads n'etiti etiti solder nkwonkwo bridging, na-ezu ohi tin. mpe mpe akwa na-ekpochapụ otu nnukwu mpe mpe akwa ikpeazụ ngwụcha ngwụcha nke nkwonkwo solder na-ejikọ ọrụ ha dị iche iche.Ya mere, n'ihi na pin spacing bụ dịtụ obere ok mpe mpe akwa, solder eguzogide ink na ohi nke solder mpe mpe akwa kwesịrị iji ọnụ.
Oge nzipu: Dec-14-2021