1. na-ekwesịghị ekwesị preheating okpomọkụ.Oke ala okpomọkụ ga-eme ka adịghị mma ebighị nke flux ma ọ bụ PCB osisi na ezughị ezu okpomọkụ, na-akpata na-ezughị tin okpomọkụ, nke mere na mmiri mmiri solder wetting ike na fluidity na-aghọ ogbenye, n'akụkụ ahịrị n'etiti solder nkwonkwo àkwà mmiri.
2. Flux preheat okpomọkụ dị oke ma ọ bụ dị ala, n'ozuzu na 100 ~ 110 degrees, preheat oke ala, ọrụ flux adịghị elu.Kpoo ọkụ nke ukwuu, n'ime nchara nchara apụọla, mana ọ dịkwa mfe ọbụna tin.
3. Ọ dịghị flux ma ọ bụ flux ezughị ma ọ bụ na-ezighị ezi, elu esemokwu nke gbazee ala nke tin adịghị ahapụ, na-akpata mfe ọbụna tin.
4. Lelee okpomọkụ nke ọkụ na-ere ọkụ, na-achịkwa ya na gburugburu 265 degrees, ọ kacha mma iji thermometer tụọ okpomọkụ nke ebili mmiri mgbe a na-egwu ebili mmiri, n'ihi na ihe mmetụta okpomọkụ nke akụrụngwa nwere ike ịdị na ala. nke oven ma ọ bụ ebe ndị ọzọ.Ezughi oke preheating okpomọkụ ga-eduga components ike iru okpomọkụ, ịgbado ọkụ usoro n'ihi akụrụngwa okpomọkụ absorption, dapụtara na ogbenye ịdọrọ tin, na guzobe ọbụna tin;enwere ike ịnwe obere okpomọkụ nke ọkụ tin, ma ọ bụ ọsọ ịgbado ọkụ dị oke ọsọ.
5. Usoro arụ ọrụ na-ezighi ezi mgbe ị na-etinye tin n'aka.
6. nyochaa mgbe niile na-eme a tin mejupụtara analysis, e nwere ike ịbụ ọla kọpa ma ọ bụ ndị ọzọ metal ọdịnaya karịa ọkọlọtọ, n'ihi na tin ngagharị na-ebelata, mfe na-eme ka ọbụna tin.
7. na-adịghị ọcha solder, solder na ngwakọta adịghị ọcha gafere ọkọlọtọ ekwe, e ji mara nke solder ga-agbanwe, wetting ma ọ bụ fluidity ga-nwayọọ nwayọọ na-adị njọ karị, ma ọ bụrụ na antimony ọdịnaya nke ihe karịrị 1.0%, arsenic karịa 0,2%, dịpụrụ adịpụ karịa 0.2%. 0.15%, mmiri mmiri nke onye na-ere ahịa ga-ebelata site na 25%, ebe ọdịnaya arsenic nke na-erughị 0.005% ga-abụ de-wetting.
8. lelee ebili mmiri soldering track angle, 7 degrees kasị mma, oke larịị dị mfe kpọgidere tin.
9. PCB osisi deformation, ọnọdụ a ga-eduga PCB ekpe n'etiti nri atọ mgbali ife omimi inconsistency, na mere site na-eri tin miri ebe tin eruba adịghị ire ụtọ, mfe na-emepụta akwa.
10. IC na ahịrị nke imewe ọjọọ, tinye ọnụ, akụkụ anọ nke IC dense foot spacing <0.4mm, enweghị tilt angle n'ime osisi.
11.pcb kpụ ọkụ n'ọnụ n'etiti sink deformation kpatara ọbụna tin.
12. PCB osisi ịgbado ọkụ n'akuku, theoretically na ukwuu n'akuku, solder nkwonkwo na ife si efegharị efegharị tupu na mgbe solder nkwonkwo si ife mgbe ohere nke nkịtị elu bụ nta, ohere nke akwa akwa bụkwa obere.Otú ọ dị, a na-ekpebi akụkụ nke soldering site na njirimara wetting nke onye na-ere ahịa n'onwe ya.N'ikwu okwu n'ozuzu, akụkụ nke soldering edu ndú bụ mgbanwe n'etiti 4 ° na 9 ° dabere na PCB imewe, ebe a na-edozi enweghị ụzọ n'etiti 4 ° na 6 ° dabere na PCB onye ahịa.Ọ ga-kwuru na na nnukwu akụkụ nke ịgbado ọkụ usoro, n'ihu ọgwụgwụ nke PCB itinye tin ga-apụta na-eri tin n'ime enweghị tin na ọnọdụ, nke na-akpata okpomọkụ nke PCB osisi n'etiti. na concave, ma ọ bụrụ na ndị dị otú ahụ ọnọdụ kwesịrị ekwesị iji belata ịgbado ọkụ n'akuku.
13. n'etiti sekit osisi mpe mpe akwa na-adịghị e mere ka iguzogide solder dam, mgbe ebi akwụkwọ na solder mado ejikọrọ;ma ọ bụ sekit osisi n'onwe ya e mere ka iguzogide solder dam / akwa, ma na okokụre ngwaahịa n'ime akụkụ ma ọ bụ ihe niile, mgbe ahụ dịkwa mfe ọbụna tin.
Oge nzipu: Nov-02-2022