PCB Board Substrate Material Classification

Ọtụtụ ụdị mkpụrụ dị iche iche ejiri maka PCB, mana kewara n'ụzọ sara mbara ụzọ abụọ, ya bụ ihe mkpụrụ osisi inorganic na ihe mkpụrụ osisi.

Inorganic mkpụrụ ihe

Inorganic mkpụrụ bụ tumadi seramiiki efere, seramiiki substrate ihe bụ 96% alumina, n'ihe banyere chọrọ a elu ike mkpụrụ, 99% dị ọcha alumina ihe nwere ike iji ma elu-ọcha alumina nhazi ihe isi ike, mkpụrụ ọnụego dị ala, ya mere, iji ọnụ ahịa alumina dị ọcha dị elu.Beryllium oxide bụkwa ihe nke seramiiki mkpụrụ, ọ bụ metal oxide, nwere ezigbo ihe mkpuchi ọkụ eletrik na ezigbo conductivity thermal, enwere ike iji ya mee ihe dị ka mkpụrụ maka sekit njupụta ike dị elu.

A na-ejikarị seramiiki sekit sekit eme ihe na sekit agbakwunyere ngwakọ na nke dị gịrịgịrị, sekit micro-mgbawa nke ọtụtụ mgbawa, nke nwere uru na ihe sekit ihe sekit enweghị ike dakọtara.Dịka ọmụmaatụ, CTE nke mkpụrụ seramiiki seramiiki nwere ike dakọtara na CTE nke ụlọ LCCC, ya mere a ga-enweta ntụkwasị obi nkwonkwo dị mma mgbe ị na-agbakọta ngwaọrụ LCCC.Na mgbakwunye, ihe ndị dị na seramiiki dabara adaba maka usoro ikuku evaporation na n'ichepụta mgbawa n'ihi na ha anaghị ewepụta nnukwu ikuku nke na-eme ka mbelata ọkwa agụụ ọbụlagodi mgbe ọkụ.Na mgbakwunye, seramiiki substrates nwekwara elu okpomọkụ nguzogide, ezigbo elu imecha, elu kemịkal kwụsie ike, bụ ọkacha mmasị sekit mkpụrụ maka oké na mkpa film ngwakọ sekit na multi-mgbawa obere mgbakọ sekit.Otú ọ dị, ọ na-esi ike hazie n'ime nnukwu na ewepụghị mkpụrụ, na-apụghị mere n'ime a multi-ibe jikọtara stampụ osisi Ọdịdị izute mkpa nke akpaghị aka mmepụta Ke adianade do, n'ihi na nnukwu dielectric mgbe nile nke seramiiki ihe, n'ihi ya, ọ. adịghịkwa mma maka ihe ntanetị nke sekit dị elu, ọnụ ahịa ya dịkwa elu.

Organic mkpụrụ ihe

A na-eji ihe ndị na-eme ka mkpụrụ osisi na-eme ka ọ dịkwuo mma dị ka akwa eriri iko (akwụkwọ fiber, ute ute, wdg), etinyere ya na ihe nkedo resin, nke a mịrị amị n'ime oghere, wee kpuchie ya na foil ọla kọpa, ma mee ya site na nnukwu okpomọkụ na nrụgide.Ụdị mkpụrụ a ka a na-akpọ ọla kọpa-clad laminate (CCL), nke a na-akpọkarị ogwe ọla kọpa, bụ ihe bụ isi maka ịmepụta PCB.

CCL ọtụtụ ụdị, ma ọ bụrụ na ihe na-agba ume na-eji kewaa, nwere ike kewaa n'ime akwụkwọ, iko eriri ákwà dabeere, composite base (CEM) na metal dabeere anọ edemede;dị ka organic resin ihe nkedo eji kewaa, na ike kewaa phenolic resin (PE) epoxy resin (EP), polyimide resin (PI), polytetrafluoroethylene resin (TF) na polyphenylene ether resin (PPO);ma ọ bụrụ na mkpụrụ ahụ siri ike ma na-agbanwe agbanwe iji kewaa, enwere ike kewaa ya na CCL siri ike na CCL na-agbanwe agbanwe.

Ugbu a ọtụtụ ebe na-eji na mmepụta nke abụọ-kwadoro PCB bụ epoxy iko eriri sekit mkpụrụ, nke na-agwakọta uru nke ezi ike nke iko eriri na epoxy resin siri ike, na ezi ike na ductility.

Epoxy iko eriri sekit sekit mkpụrụ a na-eme site na mbụ infiltrating epoxy resin n'ime iko eriri ákwà na-eme ka laminate.N'otu oge ahụ, a na-agbakwunye kemịkalụ ndị ọzọ, dị ka ndị na-agwọ ọrịa, stabilizers, anti-flammability agents, adhesives, etc. Mgbe ahụ, a na-ejikọta foil ọla kọpa ma pịa ya n'otu akụkụ ma ọ bụ n'akụkụ abụọ nke laminate iji mee eriri iko epoxy nke nwere ọla kọpa. laminate.Enwere ike iji ya mee PCB dị iche iche nwere otu akụkụ, akụkụ abụọ yana multilayer.