Na usoro nke PCBA nhazi, e nwere ọtụtụ mmepụta usoro, nke dị mfe na-emepụta ọtụtụ àgwà nsogbu.N'oge a, ọ dị mkpa ịkwalite usoro ịgbado ọkụ PCBA mgbe niile ma melite usoro iji melite ogo ngwaahịa nke ọma.
I. Meziwanye okpomọkụ na oge ịgbado ọkụ
Njikọ intermetallic n'etiti ọla kọpa na tin na-etolite ọka, ọdịdị na nha nke ọka na-adabere na ogologo oge na ike nke okpomọkụ mgbe akụrụngwa na-ere ihe dị ka.reflow ovenma ọ bụigwe na-ere ebili mmiri.PCBA SMD nhazi mmeghachi omume oge dị ogologo, ma n'ihi ogologo ịgbado ọkụ oge ma ọ bụ n'ihi na elu okpomọkụ ma ọ bụ abụọ, ga-eduga siri ike crystal Ọdịdị, Ọdịdị bụ gravelly na kenkuwa, shiee ike dị obere.
II.Belata esemokwu elu
Tin-lead solder cohesion dị ọbụna ukwuu karịa mmiri, nke mere na solder bụ a sphere ibelata elu ya (otu olu, sphere nwere kasị nta n'elu ebe ma e jiri ya tụnyere ndị ọzọ geometric shapes, iji gboo mkpa nke ala ume ala. ).Ọrụ nke flux yiri ọrụ nke ndị na-ehicha ihe na efere ígwè a na-ekpuchi mmanụ griiz, na mgbakwunye, esemokwu dị n'elu na-adaberekwa n'ókè nke ịdị ọcha na okpomọkụ, naanị mgbe ike adhesion dị ukwuu karịa elu. ike (njikọ), ezigbo itinye tin nwere ike ime.
III.PCBA bọọdụ itinye tin akụkụ
Ihe dị ka 35 ℃ dị elu karịa ebe okpomọkụ eutectic nke onye na-ere ahịa, mgbe otu dobe nke solder na-etinye n'elu ọkụ na-ekpo ọkụ na-ekpuchi ya na flux, a na-emepụta elu ọnwa na-ehulata, n'ụzọ, enwere ike ịlele ike nke elu igwe ahụ iji tinye tin. site na ọdịdị nke elu ọnwa na-ehulata.Ọ bụrụ na solder ekwe ọnwa elu nwere doro anya na ala ịkpụ onu, ekara ka a tee metal efere na mmiri ụmụ irighiri mmiri, ma ọ bụ ọbụna agbasaghị okirikiri, na metal bụ solderable.Naanị curved ọnwa elu agbatị n'ime a obere akụkụ nke na-erughị 30. Naanị ezi weldability.
IV.Nsogbu nke porosity na-emepụta site na ịgbado ọkụ
1. Baking, PCB na components kpughere na ikuku ruo ogologo oge ka akpọọ nkụ, iji gbochie mmiri.
2. Solder mado njikwa, solder tapawa nwere mmiri dịkwa mfe porosity, tin beads.Mbụ niile, na-eji ezi mma solder tapawa, solder mado tempering, edemede dị ka ọrụ nke nlezianya mmejuputa iwu, solder mado kpughere ikuku maka dị ka obere oge dị ka o kwere, mgbe obibi solder mado, mkpa n'oge reflow soldering.
3. Nlekọta iru mmiri nke ụlọ ọrụ, zubere iji nyochaa iru mmiri nke ụlọ ọrụ ahụ, na-achịkwa n'etiti 40-60%.
4. Nịm ezi uche ọkụ okpomọkụ usoro, ugboro abụọ n'ụbọchị na ọkụ okpomọkụ ule, ebuli ọkụ okpomọkụ usoro, okpomọkụ ịrị elu ọnụego nwere ike ịbụ ngwa ngwa.
5. Flux spraying, na n'eluIgwe na-ere igwe ebili mmiri SMD, ọnụ ọgụgụ nke flux spraying enweghị ike ịbụ nke ukwuu, spraying ezi uche.
6. Mee ka ọkụ ọkụ na-ekpo ọkụ ọkụ, okpomọkụ nke mpaghara preheating kwesịrị izute ihe ndị a chọrọ, ọ bụghị oke ala, nke mere na flux nwere ike ịmegharị n'ụzọ zuru ezu, na ọsọ nke ọkụ ọkụ enweghị ike ịdị ngwa ngwa.
Oge nzipu: Jan-05-2022